wedge bonding

Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength

平整度对细Al丝超声引线键合强度的影响

From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.

研究结果表明，在没有保护气氛的环境下，单晶铜丝可以热超声球键合和楔键合在金衬底和铝衬底上。

The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.

超声功率是影响粗铝丝引线键合强度的最主要因素之一。

Structure characteristics and evolution at wedge bonding interface

Ni-Al超声楔焊键合分离界面的结构特性及演变规律

Analysis on characteristics of input power and interface wedge bonding of Al-Ni ultrasonic aluminum wedge bonds

Al-Ni超声楔焊中输入功率与界面键合的特征分析

Evolution of the Bond Interface During Ultrasonic Wedge Bonding Process

超声楔键合过程界面接合部演化规律研究

Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire

Cu丝超声球焊及楔焊焊点可靠性及失效机理研究

The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.

试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。

Effect of bonding time on thick aluminum wire wedge bonding strength

键合时间对粗铝丝超声引线键合强度的影响